Title of Job : Job Vacancy DDD WF UPD Interconnect amp Assembly Engineer Singapore Company Name : Lumileds Placement : Singapore Date : 11 months ago ---> EXPIRED ! Expired : Yes
Job Vacancy DDD WF UPD Interconnect amp Assembly Engineer Singapore 2020 Lumileds. Good Afternoon for loyal visitors who are searching for job. Hopefully not despair stop to find a job that suit with interest your needed. Indeed occasionally find a job that corresponding is robust in this year. On this occasion, the admin will give news Job Vacancy DDD WF UPD Interconnect amp Assembly Engineer Singapore 2020 Lumileds. Here information more detail about Job Vacancy DDD WF UPD Interconnect amp Assembly Engineer Singapore 2020 Lumileds.
Here is requirements job description that you must meet to fill Job Vacancy DDD WF UPD Interconnect amp Assembly Engineer Singapore 2020 Lumileds which opened end of this month:
Flip Chip Interconnect Assembly & Packaging Engineer
Yishun Ave Who We Are: Companies developing automotive, mobile, IoT and illumination lighting applications need a partner who can collaborate with them to push the boundaries of light. With over 100 years of inventions and industry firsts, is a global lighting solutions company that helps customers around the world deliver differentiated solutions to gain and maintain a competitive edge. As the inventor of Xenon technology, a pioneer in halogen lighting and the leader in high performance LEDs, builds innovation, quality and reliability into its technology, products and every customer engagement. Together with its customers, is making the world better, safer, more beautiful—with light. Headquartered in the Netherlands, has approximately 9,000 team members supporting operations worldwide. The environment is fast-paced, cutting-edge, intelligent and fun! We are looking for exceptional talent to join our team! To learn more, visit .com What You Will Do:
Assume responsibility to develop Flip-chip interconnect assembly packaging solutions from design and process capabilities to meet technology and product roadmap.
Explore / innovate interconnect assembly solutions from design, prototyping and product qualification with collaborations of internal & external staffs, research institutions and vendors / suppliers.
Establish robust process margins, inline SPC controls with good Cp/Cpk performance.
Provide documentation (characterization reports, operating instructions, control plan, etc) & regular technical reporting and coordinate internally and externally to fulfil the Technology and Product Development programs.
Perform analysis on process performance, yield, manufacturing cost and cycle-time.
Contribute in planning and execution of essential continuous improvement program and ensure implementation of effective correction action.
Serve as a technical team and act as a subject matter expert.
What You Will Bring (REQUIRED Qualifications):
PhD / Master / Bachelor degree in Electrical / Physics / Material Science or equivalent with at least 5-10 years of experience with direct technical background in semiconductor interconnect assembly & packaging.
Prior work experience in new product and/or new process development and qualification.
Interconnect assembly knowledge with hands-on experience in Flip Chip bondingC2C, C2W assembly, underfill & moulding materials, and pick and place.
Knowledge with hands-on experience in laser debonding, dicing and thin submount substrate, wafer reconstitution handling will be an added advantage.
Advance semiconductor wafer level packaging assembly, wirebond and fan-in /fan-out will be a big plus.
Knowledge of production and automation equipment, processes, designs and functions.
Self-driven and strong team player with keen technical ability, proven organization skills and multitasking skills with systematic approach, detail-oriented, excellent communication and problem-solving skills.
Passionate R&D with optimistic mindset.
is an Equal Employment Opportunity Employer
Only participants that satisfies to conditions above of that will be called upon to perform debriefing. For that, if you are interested and meet the candidates Job Vacancy DDD WF UPD Interconnect amp Assembly Engineer Singapore 2020 Lumileds above, please submit your application before expired vacancies.
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